6 Amendments of Pascal ARIMONT related to 2022/0032(COD)
Amendment 133 #
Proposal for a regulation
Recital 3
Recital 3
(3) This framework pursues two objectives. The first objective is to ensure the conditions necessary for the competitiveness and innovation capacity of the Union and to ensure the adjustment of the industry to structural changes due to fast innovation cycles and the need for sustainability. The second objective, separate and complementary to the first one, is to improve the functioning of the internal market by laying down a uniform Union legal framework for increasing the Union’s resilience and security of supply in the field of semiconductor technologies by working towards one pan-European ecosystem for semiconductors in the internal market with pooled knowledge, expertise, resources and existing strengths in order to strengthen the Union’s position in a global interdependent semiconductors supply chain.
Amendment 149 #
Proposal for a regulation
Recital 5
Recital 5
(5) The use of semiconductors is critical for multiple economic sectors and societal functions in the Union and therefore, a resilient supply is essential for the functioning of the internal market. The only way to strengthen the European semiconductor market in a global interdependent semiconductor supply chain is to work towards a pan-European ecosystem within the internal market where knowledge, expertise, resources and existing strengths are pooled. Given the wide circulation of semiconductor products across borders, the resilience and security of supply of semiconductors can be best addressed through Union harmonising legislation based on Article 114 of the Treaty. With a view to enabling coordinated measures for building resilience, harmonised rules for facilitating the implementation of specific projects that contribute to the security of supply of semiconductors in the Union are necessary. The proposed monitoring and crisis response mechanism should be uniform to enable a coordinated approach to crisis preparedness for the cross-border semiconductor value chain.
Amendment 193 #
Proposal for a regulation
Recital 16
Recital 16
(16) With a view to creating a pan- European ecosystem within the internal market where knowledge, expertise, resources and existing strengths are pooled and to accelerating implementation of the actions of the Initiative, it is necessary to provide an option of implementing some of the Initiative actions, in particular on pilot lines, through a new legal instrument, the European Chips Infrastructure Consortium (ECIC). The ECIC should have legal personality. This means that when applying for the actions to be funded by the Initiative, the ECIC itself, and not individual entities forming the ECIC, can be the applicant. The main aim of the ECIC should be to encourage effective and structural collaboration between legal entities, including Research and Technology Organizations. For this reason, the ECIC has to involve the participation of at least three legal entities from three Member States and be operated as a public- private sector consortium for a specific action. The setting up of ECIC should not involve the actual setting up of a new Union body and should not be targeted at one specific action under the Initiative. It should address the gap in the Union’s toolbox to combine funding from Member States, the Union budget and private investment for the purposes of implementing actions of the Initiative. In particular, strong synergies can be attained through combined development of the different pilot lines in an ECIC, pooling the Union’s contribution with the collective resources of the Member States and other participants. The budget of the ECIC that would be made available by Member States and private sector participants over its projected period of operation should respect the timeframes of the actions implemented under this Initiative. The Commission should not be directly a party in the Consortium.
Amendment 198 #
Proposal for a regulation
Recital 19
Recital 19
(19) Integrated Production Facilities and Open EU Foundries should provide semiconductor manufacturing capabilities that are “first-of-a-kind” in the Union and contribute to the security of supply and to athe resilientce of the semiconductor ecosystem in the internal market. The qualifying factor for the production of a first-of-a-kind facility could be with regard to theAn important factor for “first-of-a-kind” is to bring an innovative element to the internal market regarding the manufacturing processes or the final product. Relevant innovation elements could be the use of a new technology node, or a new substrate material, (such as sGallium Nitride or Silicon cCarbide and gallium nitride, and other product innovation that can offer better performance, process technology or energy and environmental performance. A facility of a comparable capability on an industrial scale), or approaches that lead to performance improvements in computing power, energy efficiency, level of security, safety or reliability, as well as integration of new functionalities, such as AI, memory capacity or other. Integration of different processes and devices leading to efficiency gains or packaging and assembly automation are also examples of innovation. With regard to environmental gains, innovation elements include the reduction in a quantifiable way of the amount of energy, water or chemicals used, or increasing recyclability of materials. Such innovation should not yet substantively be present or committed to be built within the Union, excludingso that similar innovation provided by facilities for research and development or small- scale production sites would not prevent industrial semiconductor manufacturing sites from qualifying as “first-of-a-kind”. Qualification as “first-of-a-kind” holds both for new facilities, as for industrialization and volume scale-up, and modernization of existing facilities. “First-of-a-Kind” within an integrated production facility should not prevent an Open Foundry available to multiple customers from also qualifying as “first- of-a-kind” and vice versa.
Amendment 349 #
Proposal for a regulation
Article 2 – paragraph 1 – point 10
Article 2 – paragraph 1 – point 10
(10) ‘first-of-a-kind facility’ means an industrial facility capable of semiconductor manufacturing, including front-end or back-end, or both semiconductor manufacturing facility (Integrated Device Manufacturer or Open Foundry), including new facilities, industrialization, scale-up and modernization of existing facilities, which provides innovation with regard to the manufacturing process or final product, that is not yet substantively already present or committed to be built within the Union, for instance with regard to the technology node, substrate material, such as silicon carbide and gallium nitride, and other product innovation that can offer better performance, process innovation or energy and environmental performance. This includes, but is not limited to, innovation that concerns performance, improvements in computing power or in the level of security, safety or reliability, or in energy and environmental performance, or in the use of a new technology node or substrate material, or the integration of different processes and devices, or in the implementation of production processes that lead to efficiency gains;
Amendment 444 #
Proposal for a regulation
Article 7 – paragraph 1
Article 7 – paragraph 1
1. For the purpose of pooling knowledge, expertise, resources and existing strengths in one pan-European ecosystem to accelerate the implementingation of eligible actions and other related tasks funded under the Initiative a European Chips Infrastructure Consortium (‘ECIC’) may be established under the conditions set out in this Article.