2013/2905(DEA) Exemption for lead in solders on printed circuit boards, termination coatings of electrical and electronic components and coatings of printed circuit boards, solders for connecting wires and cables, solders connecting transducers and sensors that are used durably at a temperature below –20°C
Lead committee dossier:
Progress: Procedure completed - delegated act enters into force
Role | Committee | Rapporteur | Shadows |
---|---|---|---|
Lead | ENVI |
Lead committee dossier:
Subjects
Events
2014/01/07
EP - Delegated act not objected by Parliament
2013/12/19
CSL - Delegated act not objected by Council
2013/10/23
EP - Committee referral announced in Parliament
2013/10/18
European Commission - Non-legislative basic document
Documents
2013/10/18
EC - Non-legislative basic document published
Documents
2013/10/18
Initial period for examining delegated act 2.0 month(s)
Documents
- Non-legislative basic document: C(2013)06798
- Non-legislative basic document published: C(2013)06798
- Non-legislative basic document: C(2013)06798
History
(these mark the time of scraping, not the official date of the change)
2024-12-18Show (5) Changes | Timetravel
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https://webgate.ec.europa.eu/regdel/web/delegatedActsLinks/C(2013)06798
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https://webgate.ec.europa.eu/regdel/web/delegatedActsLinks/C(2013)06798
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2014-07-27Show (3) Changes | Timetravel
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2014-01-18Show (1) Changes | Timetravel
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2014-01-16Show (2) Changes | Timetravel
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2014-01-08Show (2) Changes | Timetravel
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2013-10-26Show (3) Changes | Timetravel
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2013-10-24Show (5) Changes
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